|
تفاصيل المنتج:
|
| الموصلية الحرارية: | 1.5 وات/م ك | بناء: | مطاط السيليكون المملوء بالسيراميك |
|---|---|---|---|
| نموذج: | TIF100-15-01F | لون: | أسود |
| اسم المنتج: | حشو الفجوات الحرارية مع موصلية حرارية 1.5 وات/م كلفن مما يوفر نقل الحرارة للمكونات الإلكترونية | طلب: | توفير نقل الحرارة للمكونات الإلكترونية |
| سماكة: | متوفر في Varies Thicknes | كثافة: | 2.3 جم/سم مكعب |
| الكلمات الرئيسية: | حشو الفجوة الحرارية |
Thermal Gap Filler With 1.5W/mK Thermal Conductivity Providing Heat Transfer For Electronic Components
Company Profile
Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare, communication, etc. Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, which indicate our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.
Products description
The TIF®100-15-01F Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability.
Features:
> Good thermal conductive: 1.5W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thickness
Applications:
> Mainboard/mother board
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Automotive electronics
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
| Typical Properties of TIF®100-15-01F Series | |||
| Property | Value | Test method | |
| Color | Black | Visual | |
| Construction | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 60 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.0 MHz | ASTM D150 | |
| Volume Resistivity | >1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 | |
| 1.5 W/m-K | ISO22007 | ||
Products specification
Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size:16"×16" (406 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
![]()
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
اتصل شخص: Dana Dai
الهاتف :: +86 18153789196