Brief: Discover the Black Thermal Conductive Gap Filler Pad TIF100-01, an ultra-soft silicone pad designed for GPU thermal management solutions. This product offers excellent thermal conductivity, low hardness, and electrical isolation, making it ideal for various applications in electronics and automotive industries.
Related Product Features:
Good thermal conductivity with 1.5 W/mK for efficient heat dissipation.
Naturally tacky surface eliminates the need for additional adhesive coatings.
Soft and compressible design reduces stress in low-pressure applications.
Available in various thicknesses from 0.5mm to 5.0mm to suit different needs.
Broad range of hardness options for versatile applications.
Moldable for complex parts, ensuring precise fit and performance.
Outstanding thermal performance in temperatures ranging from -40°C to 160°C.
UL 94 V0 fire rating ensures safety in high-temperature environments.
الأسئلة:
What is the thermal conductivity of the TIF100-01 thermal pad?
The TIF100-01 thermal pad has a thermal conductivity of 1.5 W/mK, ensuring efficient heat transfer for optimal thermal management.
Is the thermal pad electrically isolating?
Yes, the TIF100-01 thermal pad is electrically isolating, making it safe for use in electronic applications where electrical insulation is required.
What are the typical applications for this thermal pad?
This thermal pad is commonly used in GPUs, CPUs, LED lighting, automotive engine control units, telecommunication hardware, and various portable electronics for effective thermal management.