1.5 W/m-K High Temperature LED Gap Pad Thermal Conductive Silicone Pad for Electronic components Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... قراءة المزيد
Soft and compressible for low stress applications 1.5mmT silicone sheets for Mass storage devices The TIF160-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ... قراءة المزيد
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhesive TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and ... قراءة المزيد
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad TIF® 100 5030-05 Series TIF® 100 5030-05 Series is a well-balanced, general-purpose thermal pad ... قراءة المزيد
High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation The TIF®100-15-14S Series is a well-balanced, general-purpose thermal pad.It offers good thermal ... قراءة المزيد
Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect ... قراءة المزيد
Thermal Gap Filler Designed To Improve Thermal Conductivity And Extend Service Life Of Electronic Components Product Overview The TIF® 100-30-15S Series is a well-balanced, general-purpose thermal pad offering ... قراءة المزيد
Company pfofile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you ... قراءة المزيد
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity The TIF®100-30-02US thermally conductive interface materials are applied to fill the air gaps between the heating ... قراءة المزيد
0.5mm Thickness Fiberglass Reinforced Thermal Gap Filler Pad with 1.5 W/m-K Thermal Conductivity for Tablet PC Product Overview The TIF® 140FG-05S is engineered for efficient gap heat transfer, filling gaps and ... قراءة المزيد