|
|
تفاصيل المنتج:
|
| اسم المنتجات: | توفر حشوة الفجوات الحرارية خصائص نقل الحرارة والعزل والختم في التجميعات الإلكترونية المدمجة | سماكة: | 0.010 "~ 0.200" (0.25 ~ 5.0 مم) |
|---|---|---|---|
| الكلمات الرئيسية: | حشو الفجوة الحرارية | صلابة: | 65/45 شور 00 |
| بناء: | مطاط السيليكون المملوء بالسيراميك | كثافة: | 3.3 جرام/سم3 |
| طلب: | خصائص نقل الحرارة والعزل والختم في التجميعات الإلكترونية المدمجة | الموصلية الحرارية: | 5.0 w/mk |
The TIF®100-50-50S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.
| Property | Value | Test Method |
|---|---|---|
| Color | Pink | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 3.3 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 / 0.030~0.200 0.25~0.50 / 0.75~5.00 |
ASTM D374 |
| Hardness (Shore 00) | 65 | 45 | ASTM 2240 |
| Operating Temperature (℃) | -40 to 200℃ | - |
| Breakdown Voltage (V/mm) | ≥ 5500 | ASTM D149 |
| Dielectric Constant @1Mhz | 7.5 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | ≥1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m-K) | 5.0 | ASTM D5470 / ISO22007 |
| Fire Rating | V-0 | UL 94 (E331100) |
Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm × 406 mm)
Component Codes:
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details:
Lead Time:
Quantity: 5,000 pieces
Estimated Time: To be negotiated
Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006 as a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. Our product portfolio includes heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad, heat-conducting grease, heat-conducting plastic, silicone rubber, and silicone rubber foam.We adhere to the business philosophy of "survival by quality, development by quality," and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
اتصل شخص: Dana Dai
الهاتف :: +86 18153789196
Arabic
