logo
Arabic
منزل المنتجاتالفجوة الحرارية حشو

High Performance 1.8W Thermal Conductive Pad Sheet , Thermal Gap Filler For Telecommunication Equipment

الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
الوسادة الموصلة الحرارية تبحث وتعمل بشكل جيد للغاية. ليس لدينا حاجة إلى سادة التوصيل الحرارية الأخرى الآن!

—— بيتر جولسبي

لقد تعاونت مع Ziitek لمدة عامين ، وقدمت مواد موصلة حرارية عالية الجودة ، والتسليم في الوقت المناسب ، والتوصية بمواد تغيير المرحلة

—— أنتونيلو سا

ذات نوعية جيدة ، والخدمة الجيدة. يقدم لنا فريقك دائمًا المساعدة والحل ، ونأمل أن نكون شريكًا جيدًا طوال الوقت!

—— كريس روجرز

ابن دردش الآن

High Performance 1.8W Thermal Conductive Pad Sheet , Thermal Gap Filler For Telecommunication Equipment

High Performance 1.8W Thermal Conductive Pad Sheet , Thermal Gap Filler For Telecommunication Equipment

صورة كبيرة :  High Performance 1.8W Thermal Conductive Pad Sheet , Thermal Gap Filler For Telecommunication Equipment

تفاصيل المنتج:
Place of Origin: China
اسم العلامة التجارية: ZIITEK
إصدار الشهادات: UL and RoHs
Model Number: TIF100-18-11US
شروط الدفع والشحن:
Minimum Order Quantity: 1000pcs
الأسعار: قابل للتفاوض
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
مفصلة وصف المنتج
Products name: High Performance 1.8W Thermal Conductive Pad Sheet Thermal Gap Filler For Telecommunication Equipment Construction: Ceramic filled silicone elastomer
Keywords: Thermal Gap Filler Density: 2.7g/cc
Continuos Use Temp: -45℃ to 200℃ Hardness: 20 Shore 00
Color: Gray Thermal conductivity& Compostion: 1.8W/m-K
Thickness: 0.02~0.20inch / 0.5~5.0mmT Application: Telecommunication Equipment
إبراز:

Telecommunication Equipment Thermal Conductive Pad,1.8W Thermal Conductive Pad Sheet,Thermal Gap Filler For Telecom Equipment

,

1.8W Thermal Conductive Pad Sheet

,

Thermal Gap Filler For Telecom Equipment

High Performance 1.8W Thermal Conductive Pad Sheet Thermal Gap Filler For Telecommunication Equipment

 

Products Description

 

TIF100-18-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:

 

> Good thermal conductive : 1.8W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

> Easy release construction
> Electrically isolating
> High durability

 

Applications


> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

> Memory Modules
> Mass storage devices
> Automotive electronics

> Set top boxes

 

Key attributes

Typical Properties of TIF100-18-11US
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Density 2.7g/cc ASTM D297
Thickness range 0.02~0.20inch / 0.5~5.0mmT ASTM C351
Hardness 20 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D412
Operating Temp -45~200℃ *******
Dielectric Constant 4.5MHz ASTM D150
Volume Resistivity ≥1.0X1012Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.8W/mK ASTM D5470

 

Product Specifications

Standard Thickness:0.02" (0.50 mm)-0.20” (5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is availableincustom shapes and various forms.For other thicknesses ormore information, please contact us.

 

Details Images

High Performance 1.8W Thermal Conductive Pad Sheet , Thermal Gap Filler For Telecommunication Equipment 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

تفاصيل الاتصال
Dongguan Ziitek Electronic Materials & Technology Ltd.

اتصل شخص: Dana Dai

الهاتف :: 18153789196

إرسال استفسارك مباشرة لنا (0 / 3000)

منتجات أخرى