logo
Arabic
منزل المنتجاتالفجوة الحرارية حشو

PCB Board Silicone Thermal Pad 8.5W/M-K Insulation Conductive Pads Electric Thermal Gap Pad

الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
الوسادة الموصلة الحرارية تبحث وتعمل بشكل جيد للغاية. ليس لدينا حاجة إلى سادة التوصيل الحرارية الأخرى الآن!

—— بيتر جولسبي

لقد تعاونت مع Ziitek لمدة عامين ، وقدمت مواد موصلة حرارية عالية الجودة ، والتسليم في الوقت المناسب ، والتوصية بمواد تغيير المرحلة

—— أنتونيلو سا

ذات نوعية جيدة ، والخدمة الجيدة. يقدم لنا فريقك دائمًا المساعدة والحل ، ونأمل أن نكون شريكًا جيدًا طوال الوقت!

—— كريس روجرز

ابن دردش الآن

PCB Board Silicone Thermal Pad 8.5W/M-K Insulation Conductive Pads Electric Thermal Gap Pad

PCB Board Silicone Thermal Pad 8.5W/M-K Insulation Conductive Pads Electric Thermal Gap Pad

صورة كبيرة :  PCB Board Silicone Thermal Pad 8.5W/M-K Insulation Conductive Pads Electric Thermal Gap Pad

تفاصيل المنتج:
Place of Origin: China
اسم العلامة التجارية: ZIITEK
إصدار الشهادات: UL and RoHs
Model Number: TIF780R Series
شروط الدفع والشحن:
Minimum Order Quantity: 1000pcs
الأسعار: قابل للتفاوض
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
مفصلة وصف المنتج
Products name: PCB Board Silicone Thermal Pad 8.5W/M-K Insulation Conductive Pads Electric Thermal Gap Pad Thickness: 2.0mmT
Hardness: 30±10 Shore 00 Color: Gray
Thermal conductivity& Compostion: 8.5W/m-K Specific Gravity: 3.55g/cc
Construction: Ceramic filled silicone elastomer Continuos Use Temp: -45℃ to 200℃
Application: CPU GPU PC Motherboard Keywords: Thermal Gap Pad

PCB Board Silicone Thermal Pad 8.5W/M-K Insulation Conductive Pads Electric Thermal Gap Pad

 

TIFTM780R thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:
> Excellent thermal conductivity 8.5W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications:

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules

Typical Properties of  TIF780R Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.55g/cm3 ASTM D297
Thickness 2.0mmT ASTM D374
Hardness 30±10 Shore 00 ASTM 2240
Operating Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >4000 VAC ASTM D149
Dielectric Constant 5.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94-V0 equivalent UL
Thermal conductivity 5.5W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Thicknesses:

Product Thicknesses:0.020-inch to 0.200-inch(0.5mm to 5.0mm)

Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection. The storage condition is low temperature and dry , away from openfire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

PCB Board Silicone Thermal Pad 8.5W/M-K Insulation Conductive Pads Electric Thermal Gap Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

تفاصيل الاتصال
Dongguan Ziitek Electronic Materials & Technology Ltd.

اتصل شخص: Dana Dai

الهاتف :: 18153789196

إرسال استفسارك مباشرة لنا (0 / 3000)

منتجات أخرى