Brief: Discover the TIS™680-10AB Series, a two-component silicone thermal conductive adhesive designed for gluing metal and PCB. This high-performance adhesive offers excellent thermal conductivity, low-temperature curing, and long pot life, making it ideal for potting capacitors and electrical devices. Enhance the efficiency and lifespan of your heat-generating electronic components with this fire-resistant solution.
Related Product Features:
Good thermal conductivity: 1.0W/mK for efficient heat dissipation.
Low viscosity and easy-to-gas emissions for smooth application.
Longer working hours and excellent resistance to thermal shock.
Good solvent and water resistance for durable performance.
Fire-resistant with UL94 V-0 certification for safety.
Low shrinkage and excellent adhesion to various materials.
Suitable for potting LED lighting, power transformers, and small electrical devices.
Available in 1KG, 5KG, and 10KG packaging options.
الأسئلة:
What is the thermal conductivity of the TIS™680-10AB Series?
The TIS™680-10AB Series offers a thermal conductivity of 1.0W/mK, ensuring efficient heat dissipation.
What materials can this adhesive bond effectively?
This adhesive bonds effectively with metals, PCBs, rubber, ceramics, plastics, glass, and more, making it versatile for various applications.
What is the shelf life of the TIS™680-10AB Series?
The shelf life is 6 months for the resin and 12 months for the hardener when stored in a sealed container at 25℃.
Is the TIS™680-10AB Series fire-resistant?
Yes, it is fire-resistant and complies with UL94 V-0 standards, ensuring safety in high-temperature environments.