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Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI

الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
الوسادة الموصلة الحرارية تبحث وتعمل بشكل جيد للغاية. ليس لدينا حاجة إلى سادة التوصيل الحرارية الأخرى الآن!

—— بيتر جولسبي

لقد تعاونت مع Ziitek لمدة عامين ، وقدمت مواد موصلة حرارية عالية الجودة ، والتسليم في الوقت المناسب ، والتوصية بمواد تغيير المرحلة

—— أنتونيلو سا

ذات نوعية جيدة ، والخدمة الجيدة. يقدم لنا فريقك دائمًا المساعدة والحل ، ونأمل أن نكون شريكًا جيدًا طوال الوقت!

—— كريس روجرز

ابن دردش الآن

Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI

Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI

صورة كبيرة :  Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI

تفاصيل المنتج:
مكان المنشأ: الصين
اسم العلامة التجارية: ZIITEK
إصدار الشهادات: UL and RoHs
رقم الموديل: TIF100-66U
شروط الدفع والشحن:
الحد الأدنى لكمية: 1000 قطعة
الأسعار: قابل للتفاوض
تفاصيل التغليف: 1000 قطعة/الحقيبة
وقت التسليم: 3-5 أيام العمل
شروط الدفع: تي/تي
القدرة على العرض: 10000/يوم
مفصلة وصف المنتج
اسم المنتجات: وسادات حشو الفجوات فائقة النعومة وجيدة الانضغاط وموصلة حرارياً لتقنية 5G Aerospace AI طلب: 5G الفضاء الذكاء الاصطناعي
سماكة: 0.25 مم ~ 5.0 مم (0.010 "~ 0.200") الموصلية الحرارية: 1.5 وات/م ك
الجاذبية النوعية: 2.0 جم/سم3 صلابة: 65 شور00
البناء والتركيب: مطاط السيليكون المملوء بالسيراميك الكلمات الرئيسية: منصات الفجوة حراريا
لون: أخضر

Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI

 

 Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

The TIF®100-66U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.


Features

 

> Good thermal conductivity
> Ultra-soft and highly conformable
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

 

Applications

 

Electronic components, 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

 

Typical Properties of TIF®100-66U Series
Property Value Test method
Color Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020(0.25~0.5) 0.030~0.200 (0.75~5.0) ASTM D374
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity(W/m.K) 1.5 ASTM D5470
Fire rating V-0 UL 94 (E331100)
 
Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1(Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 
Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Questions

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470. 

تفاصيل الاتصال
Dongguan Ziitek Electronic Materials & Technology Ltd.

اتصل شخص: Dana Dai

الهاتف :: 18153789196

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