Not only about expansion, but also about innovation! Kunshan Ziitek's new base builds a new highland for the research and development of Al server thermal management

On September 28th, as the power density of AI servers continued to increase, every time the computing power rose by one order of magnitude, the "heat crisis" hidden behind it became increasingly severe. When the thermal design power of a single GPU exceeded the kilowatt mark, the traditional cooling solutions were already inadequate. Against this industry backdrop, the research and production project of Thermazig Electronics (Ziitek) thermal insulation materials and new energy electric heating sheets was officially launched. The total investment is 100 million yuan. After the project is completed, it is expected to increase the output value by 200 million yuan and generate an additional tax revenue of 20 million yuan.

Thermal interface materials, as the key materials filling the microscopic gaps between chips and heat sinks, directly determine the efficiency of the entire cooling system. According to industry predictions, by 2036, the global market size of thermal interface materials will reach approximately 53.5 billion yuan, with China accounting for more than 55% of the market share. This growth is driven by the strong demand from sectors such as AI servers and intelligent computing centers. The arms race in AI computing power is essentially a competition in cooling technology.

I. The Solution: The Strategic Layout of Thermazig Electronics (Ziitek)
Facing this huge market opportunity and technological challenge, Thermazig Electronics , relying on the industrial foundation of its parent company Ziitek Group, has launched a strategic expansion plan.

1. Core Technology Breakthrough: The project will focus on developing products such as organic silicon thermal conductive materials (thermal conductivity > 13 W/m.K), carbon fiber thermal pads (thermal conductivity > 25 W/m.K), liquid metals, and graphene thermal films. The performance will be benchmarked against international brands, aiming to break the monopoly of foreign manufacturers in the field of thermal conductive materials.

2. Capacity Upgrade: Based on the existing site at Xingpu Road 108 in Lujia Town, a 2# factory with an area of 10,000.826 square meters will be built. A research and testing center targeting the "Suzhou Engineering Technology Research Center" will be established to comprehensively enhance production capacity.

3. Global Layout: Relying on the industrial layout of Ziitek Group in Dongguan, Guangdong, Taiwan, and Vietnam, a global supply chain system will be constructed to provide stable product supply to global customers.

II. Overcoming "Critical Weaknesses": From Thermal Conductive Powder to Complete Solution
The core breakthrough point of the project lies in achieving independent technological development of thermal conductive filling powders. By establishing surface treatment equipment and production lines, Thermazig Electronics (Ziitek) will complete the entire industrial chain from raw materials to finished product manufacturing.

At present, the product line of the project has covered:
1. Thermal conductive silicone sheet: Offers multiple options for thermal conductivity to meet various cooling requirements.
2. Thermal conductive gel: Suitable for filling micro gaps, compatible with automated dispensing processes.
3. Carbon fiber thermal pad: High thermal conductivity, specially designed for high-heat dissipation scenarios.
4. Liquid metal: High thermal conductivity, targeted for high-heat dissipation applications.
Various materials are being developed. The successful development of these materials will effectively reduce the reliance of strategic industries such as semiconductors, AI servers, and new energy vehicles on international brands, providing independent and controllable thermal management solutions for the development of key national industries.

III. Looking to the Future: Building a Thermal Management Ecosystem
This expansion not only increases production capacity, but also comprehensively upgrades the R&D capabilities. The newly established R&D center will focus on:
1. Optimization of AI server cooling solution: Provide customized cooling solutions for high-density GPU clusters.
2. Thermal management for new energy vehicles: Overcome the challenges of cooling and insulation in battery packs and electric drive systems.
3. Cooling for 5G infrastructure: Provide reliable thermal management support for base stations and transmission equipment.
After the project is completed, Thermazig Electronics (Ziitek) will establish a complete capability ranging from material research and development, product design to large-scale manufacturing, providing one-stop thermal management solutions for AI server manufacturers, data center operators, and new energy vehicle enterprises.

IV. Injecting "calmness" energy into AI computing power
In today's era of rapid development of AI technology, heat dissipation has shifted from being a supporting technology to becoming a core competitiveness.Thermazig Electronics (Ziitek) 's strategic expansion of production is precisely targeting this crucial juncture of the industry transformation.

By overcoming the "critical bottleneck" problem of thermal conductive materials, Thermazig Electronics (Ziitek) not only opened up broad prospects for its own development, but also provided an important material guarantee for the infrastructure construction of China's AI industry. As the computing power revolution continues to heat up, reliable thermal management solutions will become the key cornerstone supporting the stable development of the AI industry.