pink Silicone High Insulating Heat Sink Thermal Conductive Pads with Adhesive Coating 1.5 W/mK The TIF110FG-15-25S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the ... قراءة المزيد
yellow LCD / LED High Thermally Conductive Pad , Heatsink Cooling Conductive Rubber Sheet 3.0W/mK -50 to 200℃ The TIF180-30-19S thermally conductive interface materials are applied to fill the air gaps between ... قراءة المزيد
Thermal Conductive Pad 3.0 W/mK Heatsink silicone rubber Pad TIF100-30-49U Advantage Ziitek has independent R&D team. This team is experience, rigorous and pragmatic. They undertake the core research and ... قراءة المزيد
2.0W/mk light green Ultra Soft Thermal Conductive Pad TIF100-20-07S Light Green 45 shore 00 The TIF100-20-07S thermally conductive interface materials are applied to fill the air gaps between the heating ... قراءة المزيد
TIF120-40-12E ultra soft Thermal Conductive pad For LED lighting 4 W/M-K blue thermal silicone gap filler Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have ... قراءة المزيد
TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between ... قراءة المزيد
Pink LCD Heatsink Thermal Conductive Pad 1.5W/mK ,silicone rubber sheet TIF100-15-14S, 60 Shore 00 The TIF100-15-14S Series thermally conductive interface materials are applied to fill the air gaps between the ... قراءة المزيد
UL recognized Thermal Conductive Pad, grey Silicone sheet 45 Shore 00 1.5W/mK for High speed mass storage drives The TIF100-15-02S Series thermally conductive interface materials are applied to fill the air ... قراءة المزيد
Grey Cooling Electronic Ultra Soft Thermal Conductive Pad , silicone rubber sheet 1.5w/mk with 60 shore00 hardness The TIF120-15-02F thermally conductive interface materials are applied to fill the air gaps ... قراءة المزيد
3.0 W/MK Silicone Thermal Conductive Pad For Telecommunication Hardware -50 to 200℃ The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and ... قراءة المزيد