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مدونة حول TIG7835N Liquid Metal Thermal Conductive Paste | Anti-vibration and Anti-overflow, covering the whole scene of 5G/vehic

شهادة
الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
الصين Dongguan Ziitek Electronic Materials & Technology Ltd. الشهادات
زبون مراجعة
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—— أنتونيلو سا

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ابن دردش الآن
الشركة مدونة
TIG7835N Liquid Metal Thermal Conductive Paste | Anti-vibration and Anti-overflow, covering the whole scene of 5G/vehic
آخر أخبار الشركة TIG7835N Liquid Metal Thermal Conductive Paste | Anti-vibration and Anti-overflow, covering the whole scene of 5G/vehic

TIG®7835N Liquid Metal Thermal Conductive Paste | Anti-vibration and Anti-overflow, covering the whole scene of 5G/vehicle/3C/industrial control


TIG®7835N is a thermal paste made by combining gallium-based alloy with high thermal conductivity powder. Its thermal conductivity can reach 35.0 W/mK, effectively reducing the contact thermal resistance between the heat source and the heat sink. Unlike ordinary liquid metals, this product has excellent high thixotropy, significantly reducing the risk of flow and spillage. It can be used stably on vertical chips, vibrating equipment, and portable mobile devices; when combined with foam sealing, it can avoid the problem of metal liquid leakage and short circuit in harsh environments.The temperature range covers -40 to 200℃. It is non-toxic and environmentally friendly, meeting RoHS standards. It has a smooth texture and is easy to apply, supporting screen printing for mass production, and balancing manual prototyping and batch production on the assembly line.


TIG7835N Liquid Metal Thermal Conductive Paste | Anti-vibration and Anti-overflow, covering the whole scene of 5G/vehic


1. 3C electronic & gaming equipment, essential for overclocking cooling


High-power devices such as laptops, servers, storage modules, and gaming consoles operate under high load for long periods, and the chips are prone to reducing their clock speeds due to high temperatures.The low thermal resistance characteristic of liquid metal thermal paste quickly discharges the heat from the chips. It does not flow under the conditions of device movement and long-term vibration, and is suitable for heat dissipation upgrades of gaming PCs, high-performance workstations, and portable digital devices.


2. 5G communication & network equipment, stable heat dissipation of base station modules


The wireless communication module, router, and 5G base station equipment operate continuously without interruption for years. The equipment is installed vertically and mostly operates in outdoor vibration environments.The high-viscosity formula prevents the leakage of liquid metal. The wide temperature performance is suitable for outdoor high and low temperature environments. It is compatible with communication modules, optical modules, and laser optical equipment to ensure the long-term stable operation of communication equipment.


3. Electric control system for new energy vehicles, specially designed for on-board harsh conditions


The on-board electric control and on-board computing chips are constantly exposed to a working environment with severe vibrations and large temperature differences, which requires extremely high stability of the heat-conducting materials.This product - with a wide temperature tolerance of 40~200℃, anti-vibration without overflow, can avoid the short circuit hazard of the metal heat-conducting fluid inside the vehicle, and is an excellent material for the thermal management of new energy vehicles.


TIG7835N Liquid Metal Thermal Conductive Paste | Anti-vibration and Anti-overflow, covering the whole scene of 5G/vehic


4. Industrial industrial control, LED and intelligent security, mass production of general heat dissipation


Industrial power supplies, industrial control motherboards, high-power LED lighting, outdoor security monitoring equipment, etc., mostly adopt screen printing for batch loading. TIG®7835N has a moderate viscosity, is suitable for automated construction on production lines, has strong weather resistance, and can maintain stable heat dissipation effect even under the long-term influence of wind and temperature changes in outdoor equipment, meeting the requirements of industrial mass production.


5. The product specifications are compatible with various usage scenarios


The product offers multiple packaging sizes of 1ml, 5ml, and 30ml: The small-sized packages are suitable for R&D prototyping and after-sales maintenance; the large-capacity packages are suitable for batch production on factory assembly lines, providing one-stop solutions for all stages of R&D, mass production, and maintenance for heat dissipation needs.


حانة وقت : 2026-07-07 10:35:35 >> قائمة المدونات
تفاصيل الاتصال
Dongguan Ziitek Electronic Materials & Technology Ltd.

اتصل شخص: Ms. Dana Dai

الهاتف :: +86 18153789196

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